FINAL WORD to achieve wide-range heat dissipation . Furthermore , closely coupled cooling eliminates hotspot concentrations .
To arrive at this design , Huawei leveraged the multiphysical-field simulation platform at the Thermal Lab of the Huawei Laboratories .
Due to the optimised heat dissipation design , Huawei UPS systems can function at 40 ° C for extended periods without derating . While patented innovative components further improve the heat dissipation capability , grooves on the heat sink enhance the convective heat transfer coefficient , improving heat dissipation by 10 %.
Huawei engineers utilise advanced software through simulation to predict the airspeed and temperature field of UPS components , boards and systems .
The software creates an optimal model for module layout , air channel design , and fan selection , guiding PCB and structure design .
Furthermore , patented inductors with vertical windings improve winding heat dissipation by 50 %. Compared with an aluminum heat sink , the patented multi-cavity redundant vapor chamber increases heat dissipation by 20 %.
In addition , proper matching between fans and air channels and a refined air volume control together significantly improve the heat dissipation efficiency of fans .
While maintaining verification and optimisation levels , the embryo solution has developed into an optimal heat dissipation solution .
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